SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing
نویسندگان
چکیده
.......................................................................................................................................... ii Acknowledgements ........................................................................................................................ iii List of Figures ............................................................................................................................... vii Chapter 1: Introduction and CoachComm Background.................................................................. 1 1.1 The Business ......................................................................................................................... 1 1.2 Manufacturing ....................................................................................................................... 1 Chapter 2: Literature Review .......................................................................................................... 4 2.1 Surface Mount Electronics .................................................................................................... 4 2.1.1 Component Placement ................................................................................................... 5 2.1.1.1 Gantry-Style Placement Machines .......................................................................... 9 2.1.2 Reflow Soldering ......................................................................................................... 11 2.1.2.1 Solder Pastes ......................................................................................................... 12 2.1.2.2 Preheat Phase ........................................................................................................ 17 2.1.2.3 Soak of Pre-Reflow Phase .................................................................................... 18 2.1.2.4 Reflow Phase ........................................................................................................ 21
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